| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of filling an underfill, which prevents formation of space and improves the productivity by shortening the time needed for the filling process. SOLUTION: An underfill 1 is printed on a predetermined area of a printed wiring board 4b to a thickness greater than the gap between a chip-type component 4a and the printed wiring board 4b, which is formed when the chip type component 4a is mounted on the printed wiring board 4b. Next, while the chip- type component 4a is pressed against the printed wiring board 4b with bumps 5 aligned with electrodes 3b on the board, the underfill 1 and the bumps 5 are heated so that the underfill 1 is cured, and the bumps 5 are melted. |
