| 摘要 |
A copper clad laminate for multilayer interconnected printed circuit boards consisting of an adhesive-resin coated copper foil bonded to a thin liquid crystal polymer film is disclosed. Also disclosed are laminates made from liquid crystal polymer films reinforced with dry woven and non-woven fabrics, papers, scrims, etc. A variety of resin systems can be used to coat the copper foil including both thermoplastic and thermoset polymers. As compared to copper clad laminates made with traditional resin impregnated fabrics, the thin film laminate provides an ultra smooth copper surface, a more uniform dielectric constant, improved drillability, dimensional stability, and laser/plasma micro via compatibility. Furthermore, the disclosed laminate can be used in multilayer printed circuits at a thickness much less than traditional copper clad laminates.
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