发明名称 FLOW FIELD PLATE
摘要 A flow field plate comprising surface layers of electrically conductive material, and a core layer of electrically conductive material between the surface layers within the thickness of the plate; the plate defining multiple sets of fluid passages comprising first sets of passages, one set formed in the thickness of each surface layer and open to and parallel to the surface of that layer, a second set of passages formed in the thickness of the core layer and extending transversely to the passages of the first sets to provide points of intersection with the latter when viewed in plan, ports placing passages of the second set in communication with passages of one or other of the first sets at points of intersection of the passages, and a third set of passages extending perpendicularly through the layers, without intersecting the first sets of passages, and each communicating with a passage or passages of the second set to provide fluid paths into, out of, or through the first sets of passages via the second set of passages
申请公布号 CA2241566(A1) 申请公布日期 1999.12.23
申请号 CA19982241566 申请日期 1998.06.23
申请人 BONDFACE TECHNOLOGY INC. 发明人 MACKELVIE, WINSTON R.
分类号 H01M8/0258;H01M8/2465 主分类号 H01M8/0258
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