| 摘要 |
<p>Wood wafers are produced by feeding logs (L) to a rotary cutter head drum (14) with the longitudinal axis of the logs (L) disposed substantially parallel to the rotational axis of the drum (14). The drum mounts a plurality of wafer cutting head units (28) arranged in a V-shaped pattern with the apex of the V trailing the base thereof and with the cutting blades (62) defining the ends of the base positioned at the opposite ends of the operative length of the drum (14). Each wafer cutting blade (62) having a cutting edge disposed substantially parallel to the axis of the drum (14) and offset circumferentially parallel to the axis of the drum (14) and offset circumferentially and axially from an adjacent cutting blade (62) so that the cut produced by a cutting blade overlaps the cut produced by the next adjacent preceding cutting blade.</p> |
