发明名称 AN INK JET HEATER CHIP MODULE INCLUDING A NOZZLE PLATE COUPLING A HEATER CHIP TO A CARRIER
摘要 A heater chip module (50) is provided comprising a rigid carrier (52), a nozzle plate (70) and a heater chip (60). The carrier (52) is adapted to be secured to a container (22) for receiving ink. The carrier (52) includes an opening (52c) extending through the carrier (52). The opening (52c) has an outer periphery. A nozzle plate (70) is coupled to the carrier (52) and extends out beyond the outer periphery of the opening (52c) so as to substantially cover the opening. A heater chip (60) is positioned within the opening (52c) and is coupled directly to the plate (70). The heater chip (60) is coupled to the carrier (52) only by way of the nozzle plate (70). Thus, the heater chip (60) does not directly contact the carrier (52).
申请公布号 WO9965691(A1) 申请公布日期 1999.12.23
申请号 WO1999US13499 申请日期 1999.06.16
申请人 LEXMARK INTERNATIONAL, INC. 发明人 ANDERSON, FRANK, EDWARD;MURTHY, ASHOK
分类号 B41J2/14;B41J2/16;(IPC1-7):B41J2/05;B41J2/135;B41J2/005;G01D15/16 主分类号 B41J2/14
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