CHIP CARD MODULE AND CHIP CARD COMPRISING SAME

摘要

A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.