| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant insulating resin composition for multilayer printed-wiring boards in which an insulating resin layer for multilayer printed-wiring boards is flame-retardant, is difficult to cause the lowering of its sensitivity, resolution and thermal characteristics and is improved in adhesion with plating on it. SOLUTION: This flame-retardant insulating resin composition for multilayer printed-wiring boards comprises (A) ultraviolet curing resin obtained by reacting a reaction product between a bisphenol-type epoxy resin compound and an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic acid anhydride as photoresist, (B) a polyfunctional epoxy resin as thermosetting constituent, (C) an epoxy compound having both photo-curing part and heat curing part, (D) a flame-retardant, (E) a photopolymerization initiator and (F) fillers. The flame-retardant is a bromine-containing solid compound having 1-10μm average particle diameter and is added in a quantity of 1-20 wt.% based on the total solid content of time resins. |
