Method of arranging alignment marks

摘要

A shot region includes a device region for forming a semiconductor device therein and a dicing region used for dicing. A portion of the peripheral edge portion of the shot region is defined by a portion of the peripheral edge portion of the device region. An alignment mark is arranged within the device region, and additional alignment marks are arranged within the dicing region. Thus, the number of the devices manufactured per wafer can be increased without degrading precision of alignment.