发明名称 |
MATERIAL FOR ELECTRIC AND ELECTRONIC PARTS, ITS PRODUCTION, AND ELECTRIC AND ELECTRONIC PARTS LISING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a material suitable for electric and electronic parts, especially, lead material or contact material, which is excellent in resistance to heat and surface oxidation-discoloration and which exhibits little deterioration in the jointing strength at the jointing part when it is jointed with a solder, and to provide the method for producing the electric and electronic parts using the material. SOLUTION: This material is constituted of a substrate 1 wherein at least surface layer consists of Cu or Cu alloy, an intermediate layer 2 which is formed on the substrate and has at least one layer selected from Cu-layer, Ni-layer Ni alloy-layer or Ag-layer, and a surface layer 3 which is formed on the intermediate layer 2 and consists of a Sn- or Sn alloy-layer having Cu-content of 0.1-3 wt.% and a thickness of 0.5-20 μm. |
申请公布号 |
JPH11350188(A) |
申请公布日期 |
1999.12.21 |
申请号 |
JP19980155058 |
申请日期 |
1998.06.03 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
TANI TOSHIO;TANIMOTO MORIMASA;TANAKA HITOSHI |
分类号 |
C25D5/50;C23C28/02;C25D7/00;H01L23/48 |
主分类号 |
C25D5/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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