发明名称 MATERIAL FOR ELECTRIC AND ELECTRONIC PARTS, ITS PRODUCTION, AND ELECTRIC AND ELECTRONIC PARTS LISING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a material suitable for electric and electronic parts, especially, lead material or contact material, which is excellent in resistance to heat and surface oxidation-discoloration and which exhibits little deterioration in the jointing strength at the jointing part when it is jointed with a solder, and to provide the method for producing the electric and electronic parts using the material. SOLUTION: This material is constituted of a substrate 1 wherein at least surface layer consists of Cu or Cu alloy, an intermediate layer 2 which is formed on the substrate and has at least one layer selected from Cu-layer, Ni-layer Ni alloy-layer or Ag-layer, and a surface layer 3 which is formed on the intermediate layer 2 and consists of a Sn- or Sn alloy-layer having Cu-content of 0.1-3 wt.% and a thickness of 0.5-20 μm.
申请公布号 JPH11350188(A) 申请公布日期 1999.12.21
申请号 JP19980155058 申请日期 1998.06.03
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 TANI TOSHIO;TANIMOTO MORIMASA;TANAKA HITOSHI
分类号 C25D5/50;C23C28/02;C25D7/00;H01L23/48 主分类号 C25D5/50
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