| 摘要 |
To provide trimmable inductor structure for a multichip module, direct-chip-attach or surface mount assembly in which an inductive element is formed on or near a surface of the assembly, a planar chip of dielectric or ferrite material is mounted over the inductive element, this chip having on its upper surface a trimmable metallization layer, which may for example be patterned in concentric rings or in a spiral.
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