发明名称 |
Apparatus for transferring solder bumps and method of using |
摘要 |
An apparatus and a method for transferring solder bumps from a solder mold to a solder-receiving substrate are disclosed. The apparatus includes a transfer fixture constructed by a base member, a lid member and a compressible member for holding a mold/substrate assembly therein. A plurality of compression pins are mounted through the lid member for supplying a uniform pressure on the mold/substrate assembly and for allowing lateral motion of the mold/substrate assembly relative to the transfer fixture due to a mismatch in the coefficients of thermal expansion. The compressible member is a cellulosic foam sheet which applies a uniform joining force across the entire surface of a wafer and assures abutting contact between the entire wafer and the mold surface. The foam sheet further assists in the lateral movement of the mold/substrate assembly relative to the base member of the transfer fixture.
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申请公布号 |
US6003757(A) |
申请公布日期 |
1999.12.21 |
申请号 |
US19980070120 |
申请日期 |
1998.04.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BEAUMONT, GUY DANIEL;BROUILLETTE, GUY PAUL;DANOVITCH, DAVID HIRSCH;GRUBER, PETER ALFRED |
分类号 |
B23K3/06;H01L21/00;H01L21/60;H05K3/34;(IPC1-7):B23K3/00;B23K31/02 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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