| 摘要 |
PROBLEM TO BE SOLVED: To effect the abrasion at a level where no copper is substantially left by providing a grinding slurry supply pipe whose inner surface is coated with a resin or formed of a resin, and providing various members of a grinding device which are coated with a resin or formed of a resin. SOLUTION: In a carrying robot to be used in carrying a silicon wafer 4, a hand part is coated with a resin, and a pipe 7 to supply a slurry 2 is formed of a resin or coated with a resin on its inner surface. Both a hub and a plate 1 forming major members of a grinding device are coated with a resin, and all dressing brushes of an abrasive cloth 5 are formed of a resin. Both a storage tank and a feed pump for the slurry 2 are coated with a resin. Both the abrasive cloth 5 and a wax 3 are free from copper. The residual copper content on the silicon wafer 4 is substantially zero thereby. |
