| 发明名称 |
Epoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin composition |
| 摘要 |
An epoxy resin composition for semiconductor sealing, which comprises an epoxy resin, a curing agent and an inorganic filler, and has a J-value of 10 to 50, which is a maximum jetting flow value determined according to a method of evaluating jetting flow of epoxy resin composition.
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| 申请公布号 |
US6005030(A) |
申请公布日期 |
1999.12.21 |
| 申请号 |
US19980008550 |
申请日期 |
1998.01.16 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TOGAWA, MITSUO;MIYABAYASHI, KAZUHIKO;HORIE, TAKAHIRO;NARA, NAOKI |
| 分类号 |
C08K3/36;C08K5/00;C08L63/00;(IPC1-7):C08K5/54;C08L63/02 |
主分类号 |
C08K3/36 |
| 代理机构 |
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代理人 |
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