| 摘要 |
The specification describes techniques for fabricating tapered waveguides in planar photonic integrated circuits with the tapers formed in the z-direction (thickness). The tapers are formed by depositing the core layer in two operations. After depositing the first core layer, the layer is masked, and a step is formed in the first layer. When the second core layer is deposited over the step, a smooth taper results. The core layers are preferably formed by flame hydrolysis. During consolidation the two core layers coalesce into a single homogeneous layer with a smooth taper in the thickness dimension of the waveguide.
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