发明名称 ADHESIVE FORMULATIONS
摘要 An adhesive composition including as principal components: (a) about 10-90 % by weight of at least one free radical-polymerizable monomer; (b) about 0-20 % by weight of an adhesion promoter; (c) about 10-80 % by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (Mw) less than about 18,000 or a number average molecular number (Mn) less than about 10,000; and (d) about 1-15 % by weight of an auxiliary high molecular weight toughener (or toughening agent) with a Mw greater than about 18,000 or a Mn greater than about 10,000 based on the total weight of components (a)-(d).
申请公布号 WO9964529(A1) 申请公布日期 1999.12.16
申请号 WO1999US12119 申请日期 1999.06.01
申请人 LORD CORPORATION 发明人 HUANG, JIAN-PING;RIGHETTINI, ROBIN;DENNIS, FRANCES, G.
分类号 C08F290/04;C08F290/06;C09J4/06;C09J153/02;(IPC1-7):C09J4/06;C08F290/12 主分类号 C08F290/04
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