| 摘要 |
<p>A system for inspecting potentially warped printed circuit board assemblies (118) is disclosed. The system includes an inspection head (100) with an axial, centrally located camera (100), and a laser (114) disposed at an angle off the central axis. The central camera and the angled laser can be used during an initial scan of a printed circuit board assembly to measure and compensate for warp in the assembly, thereby making a subsequent inspection of the assembly more accurate.</p> |
