| 摘要 |
A device for holding a platy material with suction cups not in contact with the platy material by supporting the platy material on a plurality of supporting pins and vacuum-sucking the platy material by the suction cups when the platy material such as wafer is transferred, wherein a vacuum produced between the platy material (51) and the suction cups (8) are led into a hollow elastic body (3) through a communication hole (11) in a lever (9), the suction cups are driven by the telescoping of the hollow elastic body, the platy material is sucked without being in contact with the suction cups so as to hold the platy material on the support pins (5), whereby the suction cups obtain, on their sucking surfaces (S), an external ring part (49) having a continuous groove surrounding their inside, and lead a vacuum to the inside of the sucking surfaces so as to suck the platy material.
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