| 摘要 |
<p>The disclosure relates to an apparatus for electrostatically adhering grains to a planar substrate comprising: a) an electrostatic chuck (10) having a collection surface with at least one grain collection zone for electrostatically directing charged grains to a corresponding surface on the planar substrate; and b) a pattern of holes through the electrostatic chuck (10) allowing a source of vacuum (15) to act through the chuck (10) to adhere the planar substrate.</p> |
