发明名称 |
Semiconductor clamping device |
摘要 |
The present invention relates to a clamping device for increasing the heat transfer between a semiconductor device and a heat dissipating device. The clamping device comprises a clamp having a pair of cooperating jaws. A resiliently biased pressure distribution member extends from one of the jaws. The pressure distribution member and the other jaw are adapted to hold a semiconductor device in contact with the heat dissipating device. A tie rod extends between the clamp jaws. A collar is provided having a central cavity for holding the semiconductor device within and aligning the semiconductor device with respect to the heat dissipating device and the clamp. The collar also has a channel for engaging the tie rod and aligning the collar such that the semiconductor device is aligned between the pressure distribution member and the opposite clamp jaw. |
申请公布号 |
AU3016499(A) |
申请公布日期 |
1999.12.16 |
申请号 |
AU19990030164 |
申请日期 |
1999.05.21 |
申请人 |
INDUCTOTHERM CORP. |
发明人 |
OLEG S. FISHMAN;ADRIAN M. ESCRIBA SR. |
分类号 |
H01L21/68;H01L23/40;H01L25/11 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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