发明名称 ADHESIVE FORMULATIONS
摘要 <p>An adhesive composition including as principal components: (a) about 10-90 % by weight of at least one free radical-polymerizable monomer; (b) about 0-20 % by weight of an adhesion promoter; (c) about 10-80 % by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (Mw) less than about 18,000 or a number average molecular number (Mn) less than about 10,000; and (d) about 1-15 % by weight of an auxiliary high molecular weight toughener (or toughening agent) with a Mw greater than about 18,000 or a Mn greater than about 10,000 based on the total weight of components (a)-(d).</p>
申请公布号 WO1999064529(A1) 申请公布日期 1999.12.16
申请号 US1999012119 申请日期 1999.06.01
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