Electronic circuit housing with improved heat dissipation for e.g. rectifiers in automobile circuits

摘要

The housing component has a metal substrate (31) with two surfaces and electronic parts (36,40) located on the substrate first surface. The housing (32) forms a body unit with a radiation rib (39) such as to fit the metal substrate to serves as a cap for the housing. The first substrate surface faces the housing. A resin (33) is arranged in a space between the substrate and the housing such that the heat, generated by the electronic parts is dissipated outwards both from the radiation rib and the second substrate surface. An Independent claim is also included for the module manufacture.