Diode laser component with heat sink providing less thermal expansion stress

摘要

A laser bar (3) and a heat sink have a carrier (2) of a material with thermal expansion coefficient greater than that of the laser bar to be mounted. The laser is flushly connected to a highly thermally conductive dielectric substrate (1) and has metallization (4a,4b) on its upper surface for carrying electric current and contacts. The laser bar is mounted on the metal coating with solder (6). The substrate is mounted over the width of the laser bar in the form of a row of individual sub-substrates (1b). An Independent claim is also included for a method of producing a diode laser component.