MICROPOROUS COPPER FILM AND ELECTROLESS COPPER PLATING SOLUTION FOR OBTAINING THE SAME

摘要

A copper metal film having 10<5> to 10<9> micropores per square centimeter and a product plated with the film. The copper metal film is obtained by immersing a work in an electroless plating solution which contains copper ions, a complexing agent, a hypophosphorus acid compound, a metal catalyst for initiating reduction, and a compound having an acetylenic bond.