发明名称 LASER BEAM MACHINING METHOD AND DEVICE THEREFOR
摘要 A laser processing method locates a processing head at a piercing start position so that the focal point of the laser beam is positioned above the workpiece surface and offset from a point right above the intended piercing point on the workpiece. While conducting irradiation with the laser beam and jetting of an assist gas, the processing head located at the piercing start position is moved simultaneously both in a direction parallel to the workpiece surface and a direction perpendicular to the workpiece surface such that the focal point approaches the piercing point.
申请公布号 KR100235178(B1) 申请公布日期 1999.12.15
申请号 KR19960055626 申请日期 1996.11.20
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KANAOKA, MASARU;MURAI, TORU;URAKAWA, AKIRA
分类号 B23K26/06;B23K26/08;B23K26/14;B23K26/36;B23K26/38;H05K3/00 主分类号 B23K26/06
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