| 摘要 |
Method for fabrication a plurality of solder structures (10) to a plurality of conductive pads (1) for a surface mount device on a surface of a printed circuit board (4). Instead of applying of a resist and forming of solder bumps by photochemical process steps, a foil made of a polymer is adhered to a surface. The openings for the solder bumps are formed by use of a laser, preferably an excimer laser. After applying and reflowing the solder paste the foil is removed together with the adhesive without residue. The method reduces the process steps and the environmental load. <IMAGE> |
