发明名称 IC PACKAGE HAVING DIRECT ATTACH BACKUP BATTERY
摘要 A molded device package (10) supports a volatile memory chip (12) and a replaceable backup battery (40) for preserving data in the event of loss of main power supply. The package includes an external socket (38) for receiving a replaceable backup battery which can be manually inserted into or removed from the socket after molding encapsulation and metal trim work have been completed. The socket is intersected by an exposure cavity which permits the positive and negative terminals of a backup battery to engage positive and negative finger leads. The positive and negative battery terminals are engaged by resilient terminal contact portions of the positive and negative finger leads which project into the exposure cavity. Socket shoulder portions and a retainer cap hold a backup battery within the socket and in electrical contact with the resilient terminal contact portions. <IMAGE>
申请公布号 KR100234141(B1) 申请公布日期 1999.12.15
申请号 KR19920003510 申请日期 1992.03.03
申请人 STMICROELECTRONICS INC. 发明人 MICHAEL J. HUNDT
分类号 G06F15/78;G11C5/14;H01L23/12;H01L23/28;H01L23/495;(IPC1-7):H01L21/56 主分类号 G06F15/78
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