| 摘要 |
A multi layered semiconductor lead frame, and a semiconductor package fabricated using the lead frame are provided. The lead frame includes a lead plate having multiple die mounting sites configured for molding multiple semiconductor packages. The lead plate includes lead fingers that form the terminal leads and internal signal traces for the molded packages. Each package includes a die mounting plate, and a ring plate attached to opposing sides of a portion of the lead plate. The die mounting plates and ring plates provide ground or voltage planes for the packages. In addition, the die mounting plates and ring plates provide improved heat transfer, reduced inductance, and matched impedance for the packages.
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