| 摘要 |
PROBLEM TO BE SOLVED: To judge the mounting position of a chip readily, by providing a plurality of electrodes connected to the substrate-side electrodes of a wiring pattern on the active surface facing a wiring board, and providing the inspection pattern indicating the positions of the electrodes in the opposite outer direction from the active surface. SOLUTION: A plurality of wiring patterns 1A comprising conducting material are formed on the mounting surface of a wiring board 1 formed of resin material. By plating gold at the time of each wiring pattern 1A, substrate-side electrodes are formed. In a bare IC chip 10, a plurality of electrodes 11 comprising conducting material such as aluminum is formed on the active surface of the wiring board 1 facing the mounting surface. Each electrode 11 is arranged so as to face each substrate electrode in the wiring board 1. Furthermore, at the outer surface 10b at the opposite side of the active surface in the bare IC chip 10, an inspection pattern 13 indicating the position of the electrode 11 is formed at the overlapping position with the respective electrode 11 observed in transmission observing the outward surface 10b of the bare IC chip 10 in the vertical direction. |
