| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase the capacity for holding a wafer and a wafer-monitoring substrate, by providing the recess parts of the first group holding wafers and she recess parts of the second group holding the wafer monitoring substrate, and arranging the respective recess parts of the second group an the vicinity of at least two recess parts of the first group. SOLUTION: A semiconductor wafer (wafer) carrier 10 has a wafer supporting surface 14 and a discoidal member 12 having the bottom surface. The wafer supporting surface 14 has the recess-part arrangement having four wafer-holding recess parts 18 and a wafer-monitoring substrate holding recess parts 20. Each wafer-monitoring substrate holding recess part 20 is arranged between two wafer-holding recess parts 18 and a surrounding part 24. The wafer-monitoring substrate holding recess part 20 has a size of about 1/10 of the wafer holding recess part 18. By this recess-part arrangement, the number of the wafer that can be processed is increased by about 33%. Furthermore, there is the advantage that the region of the wafer carrier 10 to be monitored between the wafers becomes wide by the number and the positions of the wafer-monitoring substrate holding recess parts 20 becomes wide.</p> |
