| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a heat treatment method and a heat treatment jig for facilitating handling works, such as mounting or removing, on the heat treatment jig, moreover treating a large number of wafers in a single heat treatment step. SOLUTION: A semiconductor wafer 5 is heat treated, with each of semiconductor wafers 5 hung one by one, by the use of a heat treatment jig. The heat treating jig includes a holding jig 2 with a hanging hook and two holding parts, made up of turned-up arms for holding at least two parts of the circumferential parts of the circular semiconductor wafer 5, and a supporting jig 1 for hanging the holding jig 2.</p> |
