| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of bonding a flexible circuit board with bumps to a suspension board with a circuit with high performance in bonding strength and reliability. SOLUTION: A solder-plated bump 25 of a circuit board 2 is soldered to a gold-plated bonding pad E by melting and solidifying a solder layer, wherein a gold plating layer 19 is set as thick (average thickness) as 1.5 μm or above, preferably above 2.0 μm or more preferably 2.5 μm or above. |
