| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a desmear device for removing a residue component of a via hole without a wet process. SOLUTION: This invention relates to a desmear device for removing a residue component left in a via hole formed on a metallic film of a work 17 by means of a laser piercing equipment. This desmear device comprises a laser light generator 1 for generating a laser light having a predetermined wavelength required for removing the residue component, a polygon mirror 2 for scanning the generated laser light across overall length of the work width direction, and a stage 3 for moving the work in a direction perpendicular to the scanning direction of the laser light at right angle.</p> |
