发明名称 POLYESTER RESIN LAMINATE INCORPORATED WITH IC MODULE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To improve the surface smoothness, mechanical characteristics and laminating property by using a sheet consisting of a polyester resin composition of specific composition, arranging a spacer and thermally press-forming them. SOLUTION: The resin sheet 4 is produced by using the composition obtained by blending a granular inorganic compound of 5 to 50 pts.wt. into a polyester resin of 100 pts.wt. An IC module consisting of a coil 3 and an IC chip 1 is inserted between sheets by using two pieces of the sheets 4, and next, a spacer 2 is arranged at the peripheral part of the chip 1 and they are thermally press- formed to form the objective laminate. Further, in such a case, it is desirable to define the step difference on the surface of the laminate as >=20 μm. The laminate obtained in this way is excellent in surface smoothness, high in mechanical quality and excellent in a laminating property, heat resistance, chemical resistance, dimensional stability, etc. The IC module can be in corporated between the sheets 4 without damaging the IC module and without needing any processing for the sheet 4.
申请公布号 JPH11345303(A) 申请公布日期 1999.12.14
申请号 JP19980154126 申请日期 1998.06.03
申请人 UNITIKA LTD 发明人 OSHITA MAKOTO;DOI OSAMU
分类号 B42D15/10;B32B27/36;G06K19/077;H01L21/56 主分类号 B42D15/10
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