MANUFACTURE OF SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide the manufacture of a semiconductor wafer and a semiconductor device which is capable of reducing the area of the chip of the semiconductor device, and to manufacture the semiconductor device at low cost by devising the configuration of an input/output device. SOLUTION: Bonding pads 61 and 62 are made on the transistor parts of input/output devices 41 and 42 at the peripheries of semiconductor devices 31 and 32, and pads 71 and 72 for wafer inspection which are electrically connected to these are made on a scribe lane 2. The pads 71 and 72 for wafer inspection are used for wafer inspection, and the bonding pads 61 and 62 are used at assembling. At dicing, the pads 71 and 72 for wafer inspection are cut off, so that the chip size can be reduced.