| 摘要 |
PROBLEM TO BE SOLVED: To quickly and productively machine a penetration hole for a through hole with a small diameter, by placing a metal plate with specific thickness where a resin layer with specific thickness adheres onto a surface opposite to a surface where a beam is applied for making a hole when forming the penetration hole by applying a carbon dioxide laser beam with specific output to copper foil. SOLUTION: For a copper-clad plate, a resin layer (f) with a thickness of 20-200μm, preferably the water-soluble resin layer (f), is arranged at a side in contact with copper foil (b) of a side opposite to a surface where a carbon dioxide gas laser beam is applied. A glossy metal plate (g) with a thickness of 20-200μm, preferably the metal plate (g) where the resin layer and the metal plate at least adhere partially, is placed so that the metal plate (g) is brought into contact with the resin layer (f). Then, a carbon dioxide gas laser beam with an output of 20-60 mJ/pulse is directly applied onto the surface of the copper foil (b) where an auxiliary material is arranged for making the penetration hole, thus absorbing passing carbon dioxide energy by the resin layer for reflecting by the metal plate (g), and hence making a penetration hole (d) speedily without damaging the copper foil (b). |
