| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate the strain of a solder junction, by making the cross section of each nozzle at the end of each supplying pipe larger as the distance of the nozzle from a central distributing pipe longer, and making the distribution factor of each distributing pipe for a deformable medium the same. SOLUTION: A distributor which controls a deformable medium 84 in a multiplexed state contains a central supplying pipe 83 through which the medium 84 is supplied with a very low pressure. A header 85 is connected to the central supplying pipe 86 and a plurality of distributing pipes 86, and each distributing pipe 86 requires a prescribed definite distance from the center of the supplying pipe 83. The end section of each supplying pipe 86 is formed in a nozzle. The cross section of each nozzle is correlated with the distance of each distributing pipe 86 from the center line of the central supplying pipe 83 and the nozzles having larger cross sections are positioned farther from the central supplying pipe 83. Based on this relation, the distribution factors of the distributing pipes 86 for the medium 84 can be made equal to each other. Therefore, the strains of the dielectric layer of a chip and solder ball junctions of parts can be reduced to such values which are safe to the operation of the parts.</p> |
