| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive capable of bonding electronic parts and a substrate at a normal temperature, and to provide a method for bonding electronic parts and a substrate with the adhesive. SOLUTION: The adhesive contains a polymerization initiator, a reducing agent and the main component consisting of a monomer or oligomer which can carry out redox polymerization. The first adhesive system 3a to be applied on the electronic part side 1 and the second adhesive system 3b to be applied on the substrate side 2 are appropriately divided so that, in before the bonding of an electronic part 1 and a base 2, the three components do not exist concurrently. On bonding of the electronic part 1 to the substrate 2, the two systems come in contact, and as the result, the monomer or oligomer constituting the main component is polymerized and hardened at a normal temperature. |
