METHOD AND APPARATUS FOR ELECTRONIC COMPONENT, AND THE ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To carry out resin injection and resin hardening in a short time, without bubbles in encapsulating resin. SOLUTION: In a manufacturing method for an electronic part component made up of at least two components, such as a substrate 101 and a semiconductor element 103, and these components are joined to each other face. A minute gap (α) between the opposite faces between these components is filled with an encapsulating resin 109. These components 101 and 103 joined to each other face are put in position in dies 105 and 106. The pressure of the inside thereof is reduced, and the encapsulating resin 109 is injected into the dies 105 and 106 under reduced pressure and then is hardened.