| 摘要 |
PROBLEM TO BE SOLVED: To enhance the focussing effect of a lens part as well as the optical function performed by a semiconductor device causing no nonconformity at all such as the expansion of the whole semiconductor or the liable occurrence of cracking in a resin package. SOLUTION: A semiconductor device is provided with a lead 4 having a diebonding region 40c loaded with a semiconductor chip 1, a resin package 2 having vertical thickness sealing in the semiconductor chip 1 as well as a lens part 3 provided on the upper side 2a of this resin package 2 while a part of the lead 4 is turned into an inner lead 4a advancing in this resin package 2 from the side part 2c of this resin package 2. In such a semiconductor device, the diebonding region 40c is provided on the position lower than the base end 40a of the inner lead 4a near the side part 2c of the resin package 2. |
