| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the moisture resistance and realiability of a semiconductor device by forming a base film of a hot-melt macro-molecular weight liquid crystal polymer, and applying a liquid crystal polymer with low molecular weight or an adhesive other than the liquid crystal polymer to one surface or both surfaces of the base film. SOLUTION: A plurality of inner leads 3A are adhered to the circuit formation surface of a semiconductor chip 1 with an insulative film 4 in between, and the insulative film 4 has a base film made of heat melt macromolecular weight liquid crystal polymer, and further a low molecular weight liquid crystal polymer whose molecular weight is smaller than that of the base film or an adhesive other than the liquid crystal polymer is applied to one surface or both surfaces of the base film. Since a liquid crystal polymer is used to the insulative film 4, the thermal expansion factor can be adjusted by changing the molecular weight thereof. Therefore, the thermal expansion factor of the insulative film 4 is made smaller than that of the inner lead 3A so as to prevent the deformation of the inner lead due to the difference between thermal expansion factors and improve the reliability of the semiconductor device.</p> |
