发明名称 Method of fabricating trench MOS
摘要 A semiconductor device includes a substrate, a plurality of active regions on the substrate, the active regions having recessed and elevated types and being alternatively in parallel with the substrate, respectively, and a plurality of first and second field insulating layers at field regions adjacent to the active regions, the first field insulating layer being parallel with the substrate and the second field insulating layer being perpendicular to the substrate.
申请公布号 US6001692(A) 申请公布日期 1999.12.14
申请号 US19970926027 申请日期 1997.09.09
申请人 LG SEMICON CO., LTD. 发明人 GIL, GYOUNG SEON
分类号 H01L21/316;H01L21/76;H01L21/762;H01L21/8234;H01L27/08;H01L29/40;H01L29/78;(IPC1-7):H01L21/336 主分类号 H01L21/316
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