NON-CONTACT IC CARD AND MANUFACTURE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a non-contact IC card which is constituted so that a built-in IC module, especially an IC chip and its electrical connection part is made to flexibly disperse the stress applied from the outside and not directly applied by impact and to provide its manufacturing method. SOLUTION: Break and peeling of an IC chip and its electrical connection parts are reduced and the reliability of a card is improved remarkably by such a manner that an IC module 14, an antenna 15 or an IC module inlet 17 is prevented from being contactly adhesive to a resin layer 12 so that they can shift their positions in the resin layer and accordingly the stress produced in the card is prevented from being directly transferred to the IC chip and the stress of dislocation is dispersed even when impact such as external pressure is applied to the card and the card is bent.