| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a read/write unit without generating offset and residual stress as much as possible. SOLUTION: An integrated device 54 having a micro-actuator 10 is formed on a semiconductor material wafer 29, and immovable structures 45, 47 consisting of organic material are formed on the wafer 29, a fixing flange 51 integrated with the micro-actuator 10 and an electric connection part for connecting the integrated device 54 to a read/write head are formed simultaneously, a converter 6 supporting the read/write head is connected to the fixing flange 51, the electric connection part is connected to the read/write head, and the wafer is cut to a dice, an actuator unit is connected to a suspension, and the immovable structures 45, 47 are removed. |
