WAFER AND IC CARD INTO WHICH WAFER IS BURIED

摘要

PROBLEM TO BE SOLVED: To provide a wafer whose thickness is as thin as 50-150 μm and which is used for an IC card. SOLUTION: A wafer whose thickness is 50-150 μm and whose break strength of three-point bending is not less than 50 newtons is provided. (The break strength of three-point bending is a load on a weight when a sample piece is destroyed when the square wafer sample piece by 15 mm×15 mm is loaded on a jig composed of bored cylinders having 250-300 mm diameter with a hollow cylinder of 7 mm diameter at the center of the jig so that the center point of the sample piece almost matches with the center point of the jig, a cylindrical balance whose diameter is 5 mm is abutted on the center point of the sample piece from above the sample piece and it is dropped at the speed of 1 mm/ minute).