| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability on a semiconductor ball grid array and a chip-size package through profiling of selected temperature in attachment by solder and underfill processing. SOLUTION: This method applies to a semiconductor device which includes an integrated circuit chip, a substrate 14 which is electrically insulated, many solder balls having both its parts jointed, being placed in a space of a gap 16, and a copolymer cover material for filling the gap 16, and its manufacture. The manufacture includes heating and cooling cycles which based on distortion modeling, and all the mechanical distortions of the dielectric layer of a circuit chip 10 and of the solder balls are reduced to a level which is safe for the operation of semiconductor components. |
