| 摘要 |
PROBLEM TO BE SOLVED: To prevent a crack from being generated and developed, by jointing a ceramic plate where at least one of aluminum, aluminum nitride, silicon nitride, and silicon carbide is used as a main constituent onto a bus bar part. SOLUTION: In a substrate for heat radiation, a semiconductor element- mounting part 11 made of metal and a busbar part 16 are provided on both surfaces or one surface of a ceramic substrate 10 where at least one of aluminum, aluminum nitride, silicon nitride, and silicon carbide is used as a main constituent, and at the same time a ceramic plate 20 where at least one of aluminum, aluminum nitride, silicon nitride, and silicon carbide is used as the main constituent is jointed onto the bus bar part 16. At least one type of junction materials 12 and 19 being selected from silver copper brazing alloy, silver brazing metal, aluminum brazing metal, aluminum, and polyimide are provided between the bus bar part 16 and the ceramic substrate 10 and/or the ceramic plate 20. |
