| 摘要 |
PROBLEM TO BE SOLVED: To convey and align wafers with high accuracy and to reduce the occupation area by loading at least a turn table of an aligner comprising the turn table for loading the semiconductor wafers and a sensor for positioning the wafers, on a driving element. SOLUTION: A conveying robot A comprises a driving element 1, an expandable and contractable arm 2 and an aligner 3. The expandable and contractable arm 2 comprises a fork 2a and an arm portion 2b, and the fork 2a is straightly moved by the rotational driving of the driving element 1. The aligner 3 comprises a turn table 3a rotating the semiconductor wafers and an optical sensor 3b detecting the eccentric amount and direction of the wafers, and the turn table 3a is mounted in a state that an axis of a rotary shaft is perpendicular to the moving locus of the fork 2a. By loading the turn table 3a on the driving element 1, the error in rotation of the driving element 1 itself is not relate to the positioning, and the accuracy is desired only in the expanding and contracting distance of the expandable and contractable arm 2, whereby the conveying can be performed with high accuracy. |
