发明名称 |
Structure of resin molded type semiconductor device with embedded thermal dissipator |
摘要 |
A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.
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申请公布号 |
US6002181(A) |
申请公布日期 |
1999.12.14 |
申请号 |
US19950551917 |
申请日期 |
1995.10.23 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
YAMADA, ETSUO;SHIRAISHI, YASUSHI;KAWANO, HIROSHI;OHUCHI, SHINJI;NASU, HIDEKAZU |
分类号 |
H01L23/31;H01L23/433;H01L23/495;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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