| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacture of electronic components which contribute to cost reduction of electronic components by facilitating the mounting of weak elements, and realizing the efficiency of process. SOLUTION: Man-hours can be reduced through the integration of the process of annexing an element part 34 bonded with a temporary board 33 by resin to an element annexing part 32 provided at an element transfer jig 31, and removing the temporary board 33 by etching, and after mounting all the element parts 34 at the same time in piles on a mounting board making in batch the processes of peeling off the element part 34 and the element transcribing jig 31, and furthermore the handling of a weak element is facilitated, and the manufacture contributes to the downsizing of the electronic components. |
