| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin encapsulated die for preventing dam resin from flowing into a gap between an outer lead and a die bar, when a lead frame is held firmly between upper and lower dies during resin encapsulating. SOLUTION: A resin encapsulated die includes an upper die 2 and a lower die 6, having each cavity part 1 for forming a resin semiconductor package. A lead frame 5 is held tightly and melted resin is injected into a cavity part 1 to carry out resin encapsulating. A lead-frame holding part 7 is formed around the cavity part 1 in the upper and lower dies 2 and 6, while flexible urethane resin 3 is stuck to the lead-frame holding part 7. The urethane resin 3 is deformed during the tightening of the die, and a space among the outer lead of the lead frame 5, a tie bar part 4, and the lead-frame holding part 7 of the upper and lower dies 2 and 6 is filled with the deformed urethane resin 3. As a result, the dam resin is prevented from flowing in. |
